Double-sided planetary grinding is a new process for the rapid thinning and flattening of sapphire, and experiments with it were carried out on sapphire substrates with four commonly used crystal ...Semiconductor wafers are double sided polished by a method of polishing a frontside of the wafer in a first step with a polishing pad with fixed abrasive and simultaneously polishing a backside of the wafer with a polishing pad containing no abrasive, but during which an abrasive polishing agent is introduced between the polishing pad and the backside of the wafer, inverting the wafer, and ...

💖【Double-Sided Grit Design】:Coarse grinding and fine grinding combine,which can be easy to handle coarse and fine grinding with only one double-sided diamond sharpening plate.#400 side for coarse grinding,#1000 side for fine grinding.When using,first coarse grinding and …【 】 edg-700edg1000 :。 ...

Double disk grinding is like two-sided Blanchard grinding, in that it removes material more quickly than a method such as surface grinding. (Of course, with any abrasive method, material removal speed depends on the wheel choice and other variables.) However, double disk grinding tolerances are superior to what can be achieved with a Blanchard ...The double-disc straight-groove (DDSG) grinding method is a new precision machining approach employed for the rolling surface of bearing rollers.

5.3.9.2 Method B Remove the excess mounting material from the exposed ends of pins. 5.4 Grinding and Polishing The following is a description of the basic grinding and polishing steps. Other methods may be required by contract. See Table 5-1 for examples of 2, 3, 4, and 5-step methods for Method A and Table 5-2 and Table 5-3 for Method B.Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine: : Ikeda et al. 4432245: Grinding machine motor with a torque sensor: : Hattori et al. 73/862.321

Yuan et al. (2021) introduced a chatter-mitigation method by using double-sided supporting system in milling thin-walled parts. However, many thin-walled parts, such as ribs and turbine blades, have complex double-sided features, which require much more machining operations from both sides of the part.Then the model of blade is constructed with reverse engineering method based on the measured data. At last, the tool path on blade is planned with the direction paralleled algorithm. Research work indicates that the designed double-sided grinding and polishing machine tool is practical in finishing of blade surface.

Double-sided grinding and polishing, also known as double-sided lapping and polishing is performed with particles suspended in a liquid vehicle to abrade parts equally from both surfaces. The process produces a relatively stress-free environment that induces minimal thermal distortion making it compatible with most optical materials.Double-sided planetary grinding as an efficient and precise machining method is used for the rapid thinning and flattening process of sapphire substrate. As an intermediate processing technology of sapphire substrate preparation procedure, many experiments are carried out to evaluate the lapping effect in the paper. Surface quality, processing efficiency, and surface dent depth, which all ...

This study compares the effectiveness of different polishing slurries for Double Sided Polishing process of Silicon wafer in the polished surface roughness and stock removal rate, discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries, also the influence of the pH value, temperature and concentration of the slurries are discussed in this paper.The double-sided lapping machine is mainly used for double-side lapping of crystals or other mechanical parts that are parallel on two sides, especially the processing of thin brittle materials. It is suitable for various materials of mechanical seal ring, ceramic wafer, cylinder piston ring, oil pump blade bearing end face, silicon, germanium ...

Double-Disc Grinding is a highly efficient grinding method that reduces pre-machining costs up to 50% and provides dimensional tolerances, parallelism, and flatness up to ±.001″. (For even tighter tolerances, see our Surface Grinding process.) Double-Disc Grinding uses two opposing abrasive wheels to simultaneously grind two sides of the ...Crownkyn Superhard GC-2M8470B double-sided grinder can meet the requirements of high precision surface grinding or fine grinding, by removing the excess material on the two surfaces of the parts, can obtain extremely accurate geometric precision and surface finish. Usually, this is the last grinding step in the mechanical production chain to ...

Prime silicon wafer is hard and brittle material. Due to its properties, double sided lapping machine with ceramic grinding agent were introduced for machining high quality standard silicon wafers. The main focus is the silicon wafer with high accuracy of flatness; to …grinding wheels) on surface accuracy of the sapphire substrates are investigated. It provides an experimental basis for the popularization of this new lapping method. 2. Experimental. The double-sided planetary grinding equipment structure is shown in Fig. 1, which mainly consists of

The polishing experiments were carried out on the YH2M77110 high-precision vertical double-sided grinding/polishing machine. The double-side CMP experiment system with seven sections are shown in Fig. 2(a). The polishing pad had an outer diameter of 1070 mm, an inner diameter of 495 mm, and a thickness of 3 mm.Symmetric double-sided two-way ranging is a well-known technique to deal with clock drift in time-of-flight measurements between unsynchronised devices. However, the requirement for symmetric reply delays is often not feasible. This paper presents an alternative way to process double-sided two-way ranging measurements that eliminates the need ...

Double side grinding is a process with high processing efficiency in which the wheel and the workpiece are in surface contact. But the phenomenon that the workpiece surface profile is out of tolerance exists because of the material removal non-uniformity in the grinding process. In order to improve the surface integrity of the ground workpiece, the mathematical models of grinding trajectory ...Optimization method for double-sided polishing process ... process such as cutting process, grinding process and SSP process. Each wafer, loosely held by a carrier making sun-

Double-sided lapping with the relocatable upper plate is different from double-sided grinding with stationary upper plate which the parallelism of workpiece depends on the machine accuracy. Compared with the single-sided lapping, both of the surfaces are machined at the same time with similar removal mechanism and the efficiency doubles by ...Double disk grinding is like two-sided Blanchard grinding, in that it removes material more quickly than a method such as surface grinding. (Of course, with any abrasive method, material removal speed depends on the wheel choice and other …

The invention relates to an apparatus for the double-sided, grinding machining of flat workpieces with an upper and a lower work disk, each of which has a work surface with a grinding layer, wherein the work surfaces form a work gap amongst themselves, in which workpieces can be ground, wherein at least one of the work disks is rotatably drivable by means of a driving mechanism, and further ...A calculation method for workpiece profile variation during double-sided lapping was developed in this study. In this method, shell element in FEM deformation was used to formulate elastic deformation of workpiece, and spring element was used to formulate the contact between workpiece and platens to calculate distribution of their contact pressure considering workpiece elastic deformation.

Simultaneous double side grinding (SDSG) is one of the processes to flatten the wire-sawn wafers. This paper reviews the literature on SDSG of silicon wafers, covering the history, machine development (including machine configuration, drive and support systems, and control system), and process modeling (including grinding marks and wafer shape).Double Disc Surface Grinding Machine. We designed for high precision grinding of the two paralell surfaces of flat metallic parts such as bearing, valve plate, carbide chip, seal, oil pump vane, piston ring, etc. It can also grind the flat surfaces of non-metallic parts of …

The process is a manufacturing method that employs particles of abrasive material to remove stock from a surface. It is comparable to sanding or grinding, except that sanding and grinding use abrasives that are fixed (bonded abrasives) whereas professional lapping services employs abrasives that are suspended in a liquid carrier and are free to ...12%The bearing roller is an important component of bearings [].Thus, the dimension accuracy and consistency of bearing rollers in the field of manufacturing have a considerable influence on the performance of the bearing [2,3,4]mon methods for machining cylindrical rollers include the centerless grinding method [5,6,7,8,9,10,11,12,13,14], double-sided planetary grinding …